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@inproceedings{zhaohui2010,
	Author = {Zhaohui Chen and Xiaobing Luo and Sheng Liu},
	Booktitle = {Electronic Packaging Technology High Density Packaging (ICEPT-HDP), 2010 11th International Conference on},
	Date-Added = {2012-09-13 15:17:44 -0400},
	Date-Modified = {2012-09-13 15:19:35 -0400},
	Title = {Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation},
	Year = {2010}}

@inproceedings{david2011,
	Author = {David, Howard and Fallin, Chris and Gorbatov, Eugene and Hanebutte, Ulf R. and Mutlu, Onur},
	Booktitle = {Proceedings of the 8th ACM international conference on Autonomic computing},
	Date-Added = {2012-09-11 13:44:01 -0400},
	Date-Modified = {2012-09-11 13:45:43 -0400},
	Title = {Memory power management via dynamic voltage/frequency scaling},
	Year = {2011}}

@inproceedings{barnat2010,
	Author = {Barnat, S. and Fremont, H. and Gracia, A. and Cadalen, E. and Bunel, C. and Neuilly, F. and Tenailleau, J.},
	Booktitle = {Thermal, Mechanical Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on},
	Date-Added = {2012-04-16 12:31:23 -0400},
	Date-Modified = {2012-04-16 12:33:17 -0400},
	Title = {Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via},
	Year = {2010}}

@inproceedings{noritake2006,
	Author = {Noritake, C. and Limaye, P. and Gonzalez, M. and Vandevelde, B.},
	Booktitle = {Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2006 7th International Conference on},
	Date-Added = {2012-04-15 22:17:14 -0400},
	Date-Modified = {2012-04-15 22:19:00 -0400},
	Title = {Thermal Cycle Reliability of 3D Chip Stacked Package Using Pb-free Solder Bumps: Parameter Study by FEM Analysis},
	Year = {2006}}

@inproceedings{mingche2011,
	Author = {Ming-Che Hsieh and Sheng-Tsai Wu and Wei Li and Ra-Min Tain and Lau, J.H. and Lo, R. and Ming-Jer Kao},
	Booktitle = {Microsystems, Packaging, Assembly and Circuit Technology Conference (IMPACT), 2011 6th International},
	Date-Added = {2012-04-15 16:30:10 -0400},
	Date-Modified = {2012-04-15 16:32:01 -0400},
	Title = {Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration},
	Year = {2011}}

@inproceedings{hsieh2006,
	Author = {Hsieh, M. C. and Yung-Yu Hsu and Chao-Liang Chang},
	Booktitle = {Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International},
	Date-Added = {2012-04-15 16:23:49 -0400},
	Date-Modified = {2012-04-15 16:25:41 -0400},
	Title = {Thermal Stress Analysis of Cu/Low-k Interconnects in 3D-IC Structures},
	Year = {2006}}

@inproceedings{jason2007,
	Author = {Jason Cong and Guojie Luo and Jie Wei and Yan Zhang},
	Booktitle = {Design Automation Conference, 2007. ASP-DAC '07. Asia and South Pacific},
	Date-Added = {2012-04-15 16:13:15 -0400},
	Date-Modified = {2012-04-15 16:14:25 -0400},
	Title = {Thermal-Aware 3D IC Placement Via Transformation},
	Year = {2007}}

@inproceedings{pilok,
	Author = {Pilok Lim and Taewhan Kim},
	Booktitle = {SoC Design Conference (ISOCC), 2010 International},
	Date-Added = {2012-04-15 15:49:20 -0400},
	Date-Modified = {2012-04-15 15:50:13 -0400},
	Title = {Thermal-aware resource rebinding algorithm for timing optimization in 3D IC designs},
	Year = {2010}}

@inproceedings{lau2009,
	Author = {Lau, J. H. and Yue, T. G},
	Booktitle = {Electronic Components and Technology Conference, 2009. ECTC 2009. 59th},
	Date-Added = {2012-04-15 15:45:33 -0400},
	Date-Modified = {2012-04-15 15:46:20 -0400},
	Title = {Thermal management of 3D IC integration with TSV (through silicon via)},
	Year = {2009}}

@article{pei2009,
	Author = {Pei-Yu Huang and Yu-Min Lee},
	Date-Added = {2012-04-15 15:33:25 -0400},
	Date-Modified = {2012-04-15 15:34:33 -0400},
	Journal = {Very Large Scale Integration (VLSI) Systems, IEEE Transaction on},
	Title = {Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms},
	Year = {2009}}

@inproceedings{chien2011,
	Author = {Heng-Chieh Chien and Lau, J. H. and Yu-Lin Chao and Ra-Min Tain and Ming-Ji Dai and Wei-Chung Lo and Ming-Jer Kao},
	Booktitle = {Microsystems, Packaging, Assembly and Circuit Technology Conference (IMPACT), 2011 6th International},
	Date-Added = {2012-04-15 15:17:46 -0400},
	Date-Modified = {2012-04-15 15:19:41 -0400},
	Title = {Estimation for equivalent thermal conductivity of silicon-through vias TSVs used for 3D IC integration},
	Year = {2011}}

@inproceedings{fengjuan2011,
	Author = {Fengjuan Wang and Zhangming Zhu and Yintang Yang and Ning Wang},
	Booktitle = {ASIC (ASICON), 2011 IEEE 9th International Conference on},
	Date-Added = {2012-04-15 15:08:33 -0400},
	Date-Modified = {2012-04-15 15:09:41 -0400},
	Title = {A thermal model for the top layer of 3D integrated circuits considering through silicon vias},
	Year = {2011}}

@inproceedings{jain2008,
	Author = {Jain, A. and Jones, R.E. and Chatterjee, R. and Pozder, S. and Zhihong Huang},
	Booktitle = {Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on},
	Date-Added = {2012-04-15 15:05:07 -0400},
	Date-Modified = {2012-04-15 15:06:46 -0400},
	Title = {Thermal modeling and design of 3D integrated circuits},
	Year = {2008}}

@article{jain2010,
	Author = {Jain, A. and Jones, R.E. and Chatterjee, R. and Pozder, S.},
	Date-Added = {2012-04-15 14:53:20 -0400},
	Date-Modified = {2012-04-15 14:54:24 -0400},
	Journal = {Components and Packaging Technologies, IEEE Transactions on},
	Title = {Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits},
	Year = {2010}}

@inproceedings{lau2011,
	Author = {Lau, J. H.},
	Booktitle = {Advanced Packaging Materials (APM), 2011 International Symposium on},
	Date-Added = {2012-04-15 14:46:31 -0400},
	Date-Modified = {2012-04-15 14:47:23 -0400},
	Title = {Evolution, challenge, and outlook of TSV, 3D IC integration and 3D silicon integration},
	Year = {2011}}

@inproceedings{lu2009,
	Author = {Lu, K. H. and Xuefeng Zhang and Suk-Kyu Ryu and Im, J. and Rui Huang and Ho, P.S.},
	Booktitle = {Electronic Components and Technology Conference, 2009. ECTC 2009. 59th},
	Date-Added = {2012-03-16 13:48:22 -0400},
	Date-Modified = {2012-03-16 13:49:49 -0400},
	Title = {Thermo-mechanical reliability of 3-D ICs containing through silicon vias},
	Year = {2009}}

@inproceedings{cong2011,
	Author = {Cong, J. and Guojie Luo and Yiyu Shi},
	Booktitle = {Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE},
	Date-Added = {2012-03-14 22:41:03 -0400},
	Date-Modified = {2012-03-14 22:42:15 -0400},
	Title = {Thermal-aware cell and through-silicon-via co-placement for 3D ICs},
	Year = {2011}}

@inproceedings{das2004,
	Author = {Das, Shamik and Chandrakasan, Anantha and Reif, Rafael},
	Booktitle = {Proceedings of the 14th ACM Great Lakes symposium on VLSI},
	Date-Added = {2012-03-14 22:37:51 -0400},
	Date-Modified = {2012-03-14 22:38:50 -0400},
	Title = {Timing, energy, and thermal performance of three-dimensional integrated circuits},
	Year = {2004}}

@inproceedings{kiran2006,
	Author = {Puttaswamy, Kiran and Loh, Gabriel H.},
	Booktitle = {Proceedings of the 16th ACM Great Lakes symposium on VLSI},
	Date-Added = {2012-03-14 22:34:13 -0400},
	Date-Modified = {2012-03-14 22:35:38 -0400},
	Title = {Thermal analysis of a 3D die-stacked high-performance microprocessor},
	Year = {2006}}

@inproceedings{hung2006,
	Author = {Hung, W.-L. and Link, G.M. and Yuan Xie and Vijaykrishnan, N. and Irwin, M.J.},
	Booktitle = {Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on},
	Date-Added = {2012-02-29 15:01:48 -0500},
	Date-Modified = {2012-02-29 15:03:02 -0500},
	Title = {Interconnect and thermal-aware floorplanning for 3D microprocessors},
	Year = {2006}}

@inproceedings{goplen2005,
	Author = {Goplen, Brent and Sapatnekar, Sachin},
	Booktitle = {Proceedings of the 2005 international symposium on Physical design},
	Date-Added = {2012-02-15 21:11:58 -0500},
	Date-Modified = {2012-02-15 21:12:32 -0500},
	Title = {Thermal via placement in 3D ICs},
	Year = {2005}}

@inproceedings{leduca2007,
	Author = {Leduca, P. and de Crecy, F. and Fayolle, M. and Charlet, B. and Enot, T. and Zussy, M. and Jones, B. and Barbe, J.-C. and Kernevez, N. and Sillon, N. and Maitrejean, S. and Louisa, D.},
	Booktitle = {International Interconnect Technology Conference, IEEE 2007},
	Date-Added = {2012-02-15 21:07:10 -0500},
	Date-Modified = {2012-02-15 21:07:46 -0500},
	Title = {Challenges for 3D IC integration: bonding quality and thermal management},
	Year = {2007}}

@article{hotspot,
	Author = {Wei Huang and Ghosh, S. and Velusamy, S. and Sankaranarayanan, K. and Skadron, K. and Stan, M.R.},
	Date-Added = {2012-02-15 21:00:25 -0500},
	Date-Modified = {2012-02-15 21:00:55 -0500},
	Journal = {Very Large Scale Integration (VLSI) Systems, IEEE Transactions on},
	Title = {HotSpot: a compact thermal modeling methodology for early-stage VLSI design},
	Year = {2006}}

@inproceedings{lu2010,
	Author = {Kuan H. Lu and Suk-Kyu Ryu and Qiu Zhao and Xuefeng Zhang and Jay Im and Rui Huang and Paul S. Ho},
	Booktitle = {2010 Electronic Components and Technology Conference},
	Date-Added = {2012-02-13 21:06:13 -0500},
	Date-Modified = {2012-02-13 21:07:56 -0500},
	Title = {Thermal Stress Induced Delamination of Through Silicon Vias in 3D Interconnects},
	Year = {2010}}

@inproceedings{moongon2011,
	Author = {Moongon Jung and Mitra, J. and Pan, D.Z. and Sung Kyu Lim},
	Booktitle = {Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE},
	Date-Added = {2012-02-13 21:02:23 -0500},
	Date-Modified = {2012-02-13 21:02:58 -0500},
	Title = {TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC},
	Year = {2011}}

@inproceedings{athikulwongse2010,
	Author = {Athikulwongse, K. and Chakraborty, A. and Jae-Seok Yang and Pan, D.Z. and Sung Kyu Lim},
	Booktitle = {Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on},
	Date-Added = {2012-02-13 21:00:28 -0500},
	Date-Modified = {2012-02-13 21:00:57 -0500},
	Title = {Stress-driven 3D-IC placement with TSV keep-out zone and regularity study},
	Year = {2010}}

@inproceedings{shayan2009,
	Author = {Shayan, A. and Xiang Hu and He Peng and Chung-Kuan Cheng and Wenjian Yu and Popovich, M. and Toms, T. and Xiaoming Chen},
	Booktitle = {Design, Automation Test in Europe Conference Exhibition, 2009. DATE '09.},
	Date-Added = {2012-02-13 20:59:20 -0500},
	Date-Modified = {2012-02-13 20:59:49 -0500},
	Title = {Reliability aware through silicon via planning for 3D stacked ICs},
	Year = {2009}}

@article{selvanayagam2009,
	Author = {Selvanayagam, C.S. and Lau, J.H. and Xiaowu Zhang and Seah, S. and Vaidyanathan, K. and Chai, T.C.},
	Date-Added = {2012-02-13 20:56:41 -0500},
	Date-Modified = {2012-02-13 20:57:19 -0500},
	Journal = {Advanced Packaging, IEEE Transactions on},
	Title = {Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps},
	Year = {2009}}

@inproceedings{liu2009,
	Author = {Xi Liu and Qiao Chen and Dixit, P. and Chatterjee, R. and Tummala, R.R. and Sitaraman, S.K.},
	Booktitle = {Electronic Components and Technology Conference, 2009. ECTC 2009. 59th},
	Date-Added = {2012-02-13 20:54:58 -0500},
	Date-Modified = {2012-02-13 20:55:33 -0500},
	Title = {Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)},
	Year = {2009}}

@inproceedings{hsieh2011,
	Author = {Ming-Che Hsieh and Sheng-Tsai Wu and Chung-Jung Wu and Lau, J.H. and Ra-Min Tain and Wei-Chung Lo},
	Booktitle = {Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on},
	Date-Added = {2012-02-13 20:45:05 -0500},
	Date-Modified = {2012-02-13 20:45:47 -0500},
	Title = {Energy release rate investigation for through silicon vias (TSVs) in 3D IC integration},
	Year = {2011}}

@inproceedings{lu2011,
	Author = {Kuan-Hsun Lu and Suk-Kyu Ryu and Im, J. and Rui Huang and Ho, P.S.},
	Booktitle = {Reliability Physics Symposium (IRPS), 2011 IEEE International},
	Date-Added = {2012-02-13 20:43:42 -0500},
	Date-Modified = {2012-02-13 20:44:30 -0500},
	Title = {Thermomechanical reliability of through-silicon vias in 3D interconnects},
	Year = {2011}}

@article{ryu2011,
	Author = {Suk-Kyu Ryu and Kuan-Hsun Lu and Xuefeng Zhang and Jang-Hi Im and Ho, P.S. and Rui Huang},
	Date-Added = {2012-02-13 20:34:20 -0500},
	Date-Modified = {2012-02-13 20:35:15 -0500},
	Journal = {Device and Materials Reliability, IEEE Transactions on},
	Title = {Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects},
	Year = {2011}}

@inproceedings{yibo2011,
	Author = {Yibo Chen and Kursun, E. and Motschman, D. and Johnson, C. and Yuan Xie},
	Booktitle = {Low Power Electronics and Design (ISLPED) 2011 International Symposium on},
	Date-Added = {2012-02-13 20:19:13 -0500},
	Date-Modified = {2012-02-13 20:22:35 -0500},
	Title = {Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs},
	Year = {2011}}
